Sales & Distribution of Equipment
設備的銷售與代理
Our Sales and Distribution
Automatic RCA Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | Cleaning of 6 - 12 inch wafers |
| Batch Production Capacity | 25/50pcs/batch |
| Process Flow | LOAD⭢SPM⭢ODR⭢DHF⭢ODR⭢SC1⭢ODR⭢SC2⭢ODR⭢ |
| Main Materials | Metal frame + PVC/PPW shell, tank made of quartz/PPN/PTEE |
| Transportation Method | Mechanical arm transfer |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Process Effect | Particle removal rate > 99% |
| Other Specifications | The devices can be customized as manual/semi-automatic according to customer requirements |
Automatic Solvent Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | 8 - 12 inch wafer dewaxing and cleaning |
| Batch Production Capacity | 8 - 12 inches, 13/25pcs/batch |
| Process Flow | FOUP⭢EFM⭢Dewaxing⭢IPA⭢QDR⭢QDR⭢DRYING⭢EFM⭢FOUP |
| Main Materials | SUS frame + SUS shell, tank made of SUS316L quartz/PVDF/PTFE material |
| Transportation Method | Mechanical arm transfer |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Process Effect | Dewaxing efficiency > 99% |
| Other Specifications | The devices can be customized as manual/semi-automatic according to customer requirements |
Single Wafer Wet Cleaning Equipment
| ITEM | ITEM SPECIFICATION |
|---|---|
| Application areas | RCA cleaning, pre-deposition cleaning, post-etch cleaning, CMP post-cleaning, wet etching, pre-EPI cleaning, etc. |
| Wafer size | 100mm - 300mm |
| Equipment Configuration Other Specifications | 4 - 16 chambers (customizable) |
| Supports 24 CST/SMIF/FOUP loading and unloading | |
| Supports automatic chemical liquid supply CCSS, LCSS | |
| Heating control, concentration control, flow control, pressure control, etc. | |
| Acid, alkali, organic liquid exhaust separation | |
| Supports chemical liquid recycling | |
| High-definition camera, E-FLOW (optional) | |
| Fully supports SECS/GEM communication protocol | |
| Process indicators | Etching uniformity: intra-wafer: ≤3%； inter wafer :≤3%; inter-batch: ≤3% |
| Particle contro | Added value < 20 particles @ 0.2 microns (with silicon oxide film test) |
| Metal ions | incoming particles <50 |
Automatic Plating Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | 2-12 inch wafer plating |
| Batch Production Capacity | 1pcs/batch |
| Process Flow | Pretreatment⭢Plating⭢Wafer rinse (Au Ni Cu ...) |
| Main Materials | Metal frame + PVC/PPW shell, tank made of PVDF/PPN |
| Transportation Method | Manual transmission |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Other Specifications | This equipment can be customized manually/semi-automatically according to customer requirements |
Automatic Wafer Corrosive Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | Cleaning of 6 – 12 inch wafers |
| Batch Production Capacity | 25pcs/batch |
| Process Flow | LOAD⭢SC1⭢QDR⭢SC2⭢QDR⭢DHF⭢ODR⭢DRYING⭢UNLOAD |
| Main Materials | Metal frame + PVC/PPW shell, tank made of quartz/PPN/PTFE materia |
| Transportation Method | Mechanical arm transfer |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Process Effect | Particle removal rate >99% |
| Other Specifications | his device can be customized manual/semi-automatic according to customer requirements |
Metal Etching Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | Cleaning of 6 – 8 inch wafers |
| Batch Production Capacity | 8-inch 25PCS/batch |
| Process Flow | Cu etching⭢ODR⭢Ti etching⭢ODR⭢Au etching⭢ODR |
| Functionality of Process tanks | Cyclic filtration + heating and cooling + up-down shaking + basket lifting |
| Main Materials | Metal frame + PVC/PPW shell, tank made of PVDF/PPN |
| Transportation Method | Manual transmission |
| Cycle time | Adjusting 5-15 minutes according to process requirements |
Parts Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | 8/12 inch wafer/silicon ring |
| Batch Production Capacity | 10 pieces |
| Main Materials | Metal frame + PVC/PPW shell, tank made of SUS316L/PPN material |
| Transportation Method | Automatic transmission |
| Cycle time | Process adjustable from 5 to 30 minutes |
| Other Specifications | This equipment can be customized fully automatic according to customer requirements |
CDS Supply System
| ITEM | ITEM SPECIFICATION |
|---|---|
| Process Flow | Liquid blending and supply |
| Main Materials | Metal frame +PP/SUS304 shell |
| Transportation Method | Automatic transmission (acid, alkali, organic |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Other Specifications | This equipment can be customized according to customer requirements |
EP Slurry Supply System
| ITEM | ITEM SPECIFICATION |
|---|---|
| Process Flow | Liquid blending and supply |
| Main Materials | Metal frame + PVC/PPW shell |
| Transportation Method | Automatic transmission (Polishing liquid) |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
| Other Specifications | This equipment can be customized (self-circulation, concentration, temperature, PH monitoring, stirring) |
Alkali Engraving Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to workpieces | Silicon ring diameter 300-650mm, fixture adjustable, vertical cleaning |
| Batch production capacity | 2PCS/batch |
| Process Flow | Liquid blending and supply |
| Functionality of process tanks | Cyclic filtration + heating + buddling + rotation |
| Main materials | Metal frame + PPW shell, tank made of PPN/PTFE material |
| Transportation methods | Mechanical arm transfer |
| Cycle time | Adjusting 5-15 minutes according to process requirements |
Semi-Automatic SPM Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | Cleaning of 6 – 8 inch wafers |
| Batch Production Capacity | 8-inch 25PCS/batch |
| Process Flow | SPM⭢QDR(40-60°C)⭢QDR |
| Functionality of Process Tanks | Cyclic filtration + Heating and Cooling |
| Main Materials | Metal frame + PVC/PPW shell, tank made of PPN/PVDF material |
| Transportation Method | Mechanical arm automatic forward and backward transmission |
| Cycle time | Adjusting 5-15 minutes according to process requirements |
Silicon Electrode Vacuum Etching
Cleaning Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | Silicon electrode diameter 345600mm, thickness 1030mm, weight 5-15KG |
| Batch Production Capacity | 1PCS/batch |
| Process Flow | Hole acid etching⭢Rinsing |
| Main Materials | Metal frame + PPW shell, tank made of PVDF/PPN material |
| Transportation Method | Mechanical arm transfer |
| Cycle time | Adjusting 5-10 minutes according to process requirements |
Semi-Automatic Developer Bench
| ITEM | ITEM SPECIFICATION |
|---|---|
| Adaptation to Workpieces | 4-8 inch wafer cleaning |
| Batch Production Capacity | 8-inch 25PCS/batch |
| Process Flow | QDR⭠Development⭢QDR⭠Development⭢QDR |
| Functionality of Process tanks | Cyclic filtration + heating and cooling + up-down shaking + silicon wafer rolling |
| Main Materials | Metal frame + PVC/PPW shell, tank made of PPN/PVDF material |
| Transportation Method | Manual transmission |
| Cycle time | Adjusting 5-15 minutes according to process requirements |