DNN TECHNOLOGY

Advanced Packaging Guide (Pt. 5): 2026 Supply Chain, CPO & KGD Market Definition​

Advanced Packaging Guide (Pt. 5): 2026 Supply Chain, CPO & KGD Market Definition​

Advanced Packaging Guide (Pt. 5): 2026 Supply Chain, CPO & KGD Market Definition Recap The first four parts of this guide series have mapped out the evolutionary blueprint of the semiconductor industry in the post-Moore’s Law era. We began in Part 1 by exploring why advanced packaging has become the new frontier of innovation against […]

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DNN Technology team promoting Taiwan Semiconductor Equipment at SEMICON exhibitions

2025-2026 OUTLOOK

2025-2026 Outlook: Leading Taiwan Semiconductor Equipment into Southeast Asia A Heartfelt Thank You “To us, you are more than just a partner—you are a friend whose trust has given DNN Technology the strength to keep moving forward.” 2025 Retrospective: Strengthening the Global Supply Chain As 2025 concludes, DNN Technology celebrates a year of strategic expansion

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DNN Technology and NTS Technology Sign Strategic MOU to Integrate Laser Processing System Distribution, Accelerating ASEAN Expansion with 3 Key Strategies

DNN Technology and NTS Technology Sign Strategic MOU to Integrate Laser Processing System Distribution, Accelerating ASEAN Expansion with 3 Key Strategies

DNN Technology and NTS Technology Sign Strategic MOU to Integrate Laser Processing System Distribution, Accelerating ASEAN Expansion with 3 Key Strategies Press Release — Taipei, Taiwan — November 10, 2025 — DNN Technology Co., Ltd. and NTS Technology Co., Ltd. officially signed a Memorandum of Understanding (MOU) on October 30, 2025, marking the beginning of

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歐耀科技與恩馳科技合作,推行雷射精密加工設備

歐耀科技與恩馳科技簽署合作備忘錄,整合設備通路和雷射精密加工技術,三大策略加速東協佈局

歐耀科技與恩馳科技簽署合作備忘錄,整合設備通路和雷射精密加工技術,三大策略加速東協佈局 新聞稿 台北,2025年11月10日 — 歐耀科技(DNN Technology Co., Ltd.) 與 恩馳科技(NTS Technology Co., Ltd.)於 2025年10月30日 正式簽署 合作備忘錄(MOU) 瞄準東協半導體市場,整合雙方核心優勢 此次簽署儀式於歐耀科技台灣新竹總部舉行,宣示雙方將於半導體設備與先進製程整合領域展開長期策略合作。雙方將整合歐耀團隊在半導體設備顧問與市場佈局的二十年以上經驗,以及恩馳科技於雷射精密加工與自動化控制的頂尖技術實力,共同深耕東協 (ASEAN) 市場,攜手推動區域產業升級與在地化發展。 市場報告顯示,東協半導體市場預計從 2025 年的 1,054.9 億美元成長至 2034 年的 2,473.2 億美元,期間的年複合成長率(CAGR)高達 9.93%。其中,馬來西亞為主導市場,光是檳城就擁有超過 350 家跨國企業,並有超過 3,000 家製造相關的中小企業支持。而泰國與越南則被視為成長最快的國家,成長率皆為 10 % 以上。 明確策略分工:歐耀的通路與恩馳的技術 根據合作備忘錄,歐耀科技將憑藉其長期深耕於半導體設備買賣、封裝技術顧問及無塵室建制的專業,利用其在新加坡、馬來西亞、越南與泰國市場超過 30 間合作夥伴的綿密網絡,負責設備推廣、市場佈局,並協助區域客戶進行產線設計與跨國供應鏈整合。 恩馳科技則提供其強大的技術後盾,專注於「飛行連續加工控制系統」與「雷射精密加工技術」,提供關鍵技術支援與測試整合。其核心技術涵蓋雷射圖形直寫蝕刻 (LDI)、高速高精度鑽孔與高品質均勻加工,能廣泛應用於脆性材料(如玻璃、陶瓷、藍寶石、晶圓 Wafer)與軟性薄膜材料(如 FPC、PCB、PI 薄膜、軟性電路)。 合作願景:共創東協市場雷射精密加工解決方案 歐耀科技董事長 Derek Phua 表示:「東協是全球半導體版圖中增長最快的區域,我們很期待能與恩馳共同開拓這片市場」,Derek 補充道:「憑藉恩馳頂尖的雷射技術,結合我們在地的市場洞察與服務網絡,將使我們能為新加坡、馬來西亞、越南和泰國等地的客戶提供從產線設計到精密加工的一站式解決方案,成為他們產業升級的最佳夥伴。」 恩馳科技總經理周益欽也表示:「恩馳的核心優勢在高精度的控制整合,搭配自主開發的多功能軟體,可提供客戶面向先進封裝的多樣化製程方案。例如垂直向的高精度鑽孔、水平向的細線路圖形蝕刻,都已有成功的案例。透過歐耀完善的區域通路,我們有信心將這套高效能、高良率的解決方案,快速導入東協市場,協助客戶在關鍵材料加工上取得領先。」 此次 MOU

歐耀科技與恩馳科技簽署合作備忘錄,整合設備通路和雷射精密加工技術,三大策略加速東協佈局 Read More »

Advanced Packaging : Solving Thermal & Material Challenges

Advanced Packaging Guide (Pt. 4): Solving Thermal & Material Challenges

Advanced Packaging Guide (Pt. 4): Solving Thermal & Material Challenges The remarkable capabilities of advanced packaging are not magic; they are built upon a complex foundation of materials science and physics. Squeezing multiple high-power components into a microscopic space creates a tightly coupled system where performance is dictated by fundamental forces.  This article explores that

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Heterogeneous Integration in Advanced Packaging

Advanced Packaging Guide (Pt. 3): The Chiplet Revolution and Heterogeneous Integration​

This article focuses on that strategic shift. We will explore the move toward disaggregation by defining what “chiplets” are and why they are so compelling.

We will then explain the power of Heterogeneous Integration—the art of mixing and matching these chiplets—and detail the critical role of the Universal Chiplet Interconnect Express (UCIe) standard in creating the open, “plug-and-play” ecosystem of the future.

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SEMICON SEA 2025 Recap Video

Semicon SEA 2025 Recap Video

Discover the highlights from Semicon SEA 2025 recap video, a pivotal event in Singapore that showcased the latest in semiconductor innovation across Southeast Asia! This gathering united global leaders, engineers, and decision-makers, fostering collaboration and knowledge exchange in the ever-evolving tech landscape. DNN Technology 歐耀科技 presented cutting-edge solutions, including end-to-end equipment consulting, advanced packaging techniques, and expertise in cleanroom construction. Don’t miss the chance to explore the future of technology and watch our exhibition video for an inside look at the groundbreaking advancements shared at this remarkable event!

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FOWLP/2.5D INTERPOSER/3D PACKAGING

Advanced Packaging Guide (Pt. 2): 2.5D vs. 3D-IC vs. FOWLP

In the rapidly evolving world of semiconductor technology, advanced packaging is revolutionizing how we design and integrate electronic systems. Discover the transformative power of 2.5D and 3D-IC architectures, which are breaking through the limitations of traditional 2D packaging. Learn how these innovations address critical challenges like latency and power consumption, enabling high-performance applications in AI and HPC. Plus, explore the cost-effective Fan-Out Wafer-Level Packaging (FOWLP) that democratizes high-density integration for consumer electronics. Dive into our comprehensive guide to uncover the future of semiconductor packaging and its impact on the next generation of electronics!

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DNN TECH INTECH GROUP

DNN-TECH and INTECH Group Sign Strategic Partnership MOU to Expand Semiconductor Market in ASEAN

DNN-TECH and INTECH Group Sign Strategic Partnership MOU to Expand Semiconductor Market in ASEAN Press Release Taipei, Taiwan, Feb 25, 2025 – DNN-TECH, a leading semiconductor solutions provider based in Hsinchu, Taiwan, and INTECH Group, Vietnam’s premier EPC contractor, have signed a Memorandum of Understanding (MOU) to commence collaboration. The partnership will focus on semiconductor packaging technology, capacity

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A computer chip using 2.5D Advanced Packaging technology with chiplets, interposer, TSV, RDL and PCB.

Advanced Packaging Guide (Pt. 1): Why 2.5D & Chiplets Are the Mainstream Choice After Moore’s Law?

In the rapidly evolving semiconductor landscape, the traditional path of Moore’s Law is giving way to a revolutionary approach: advanced packaging. As the demand for computational power surges, innovative solutions like 2.5D and chiplet architectures are reshaping how we design and build complex electronic systems. This first article in our series delves into the critical shift from monolithic Systems-on-Chip (SoCs) to modular Systems-in-Package (SiPs), highlighting the transformative potential of advanced packaging. Discover how this paradigm shift is not just a technical evolution but a strategic necessity for the future of electronics.

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