DNN Technology

DNN TECHNOLOGY

FOWLP/2.5D INTERPOSER/3D PACKAGING

Advanced Packaging Guide (Pt. 2): 2.5D vs. 3D-IC vs. FOWLP

Advanced Packaging Guide / By

In the rapidly evolving world of semiconductor technology, advanced packaging is revolutionizing how we design and integrate electronic systems. Discover the transformative power of 2.5D and 3D-IC architectures, which are breaking through the limitations of traditional 2D packaging. Learn how these innovations address critical challenges like latency and power consumption, enabling high-performance applications in AI and HPC. Plus, explore the cost-effective Fan-Out Wafer-Level Packaging (FOWLP) that democratizes high-density integration for consumer electronics. Dive into our comprehensive guide to uncover the future of semiconductor packaging and its impact on the next generation of electronics!

Advanced Packaging Guide (Pt. 2): 2.5D vs. 3D-IC vs. FOWLP Read More »

DNN TECH INTECH GROUP

DNN-TECH and INTECH Group Sign Strategic Partnership MOU to Expand Semiconductor Market in ASEAN

Press Release / By

DNN-TECH and INTECH Group Sign Strategic Partnership MOU to Expand Semiconductor Market in ASEAN Press Release Taipei, Taiwan, Feb 25, 2025 – DNN-TECH, a leading semiconductor solutions provider based in Hsinchu, Taiwan, and INTECH Group, Vietnam’s premier EPC contractor, have signed a Memorandum of Understanding (MOU) to commence collaboration. The partnership will focus on semiconductor packaging technology, capacity

DNN-TECH and INTECH Group Sign Strategic Partnership MOU to Expand Semiconductor Market in ASEAN Read More »

A computer chip using 2.5D Advanced Packaging technology with chiplets, interposer, TSV, RDL and PCB.

Advanced Packaging Guide (Pt. 1): Why 2.5D & Chiplets Are the Mainstream Choice After Moore’s Law?

Advanced Packaging Guide / By

In the rapidly evolving semiconductor landscape, the traditional path of Moore’s Law is giving way to a revolutionary approach: advanced packaging. As the demand for computational power surges, innovative solutions like 2.5D and chiplet architectures are reshaping how we design and build complex electronic systems. This first article in our series delves into the critical shift from monolithic Systems-on-Chip (SoCs) to modular Systems-in-Package (SiPs), highlighting the transformative potential of advanced packaging. Discover how this paradigm shift is not just a technical evolution but a strategic necessity for the future of electronics.

Advanced Packaging Guide (Pt. 1): Why 2.5D & Chiplets Are the Mainstream Choice After Moore’s Law? Read More »

DNN-TECH 3rd Anniversary

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners​

Press Release / By

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners  Three years ago, DNN-TECHNOLOGY started as a small business with a big vision. Today, we’re celebrating our anniversary—and we couldn’t be prouder of the journey so far! This past year has been filled with growth and new achievements—we expanded into 5 more cities,

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners​ Read More »

Semiexpo 2024

SEMI Expo Vietnam 2024

Press Release / By

SEMINAR ON OVERVIEW OF SEMICONDUCTOR MANUFACTURING [Vietnam, November 7, 2024] At the BK Smart Tech Office – Hanoi University of Science and Technology, part of the National Innovation Center (NIC) in Hoa Lac High-Tech Park, Hanoi, the seminar “Overview of Semiconductor Manufacturing” was successfully held.  The event attracted a large gathering of industry experts, representatives from

SEMI Expo Vietnam 2024 Read More »

Tech Stage Presentation

Tech Stage Presentation

Tech Info / By

SEMI Southeast Asia 2025｜TECH STAGE Presentation Our Project Manager Chris Wang delivered an insightful talk at SEMI Southeast Asia 2025, “Advanced Packaging Design, Manufacturing, and Testing Introduction” 🔍 Key Takeaways from the Talk 1️⃣Chiplets: Definition & Benefits • Separately manufactured chips integrated via advanced packaging • Each chip uses the most suitable process node (e.g.,

Tech Stage Presentation Read More »

DNN's member posing for a photo.

SEMICON SEA 2025

Press Release / By

DNN Technology Demonstrates Outstanding Technical Expertise at SEMICON SEA 2025 [Singapore, May 23, 2025] DNN Technology showcased its exceptional industry influence and technological capabilities at SEMICON SEA 2025, held from May 20 to 22 at the Marina Bay Sands Expo Center in Singapore. The SEMICON SEA 2025 event attracted over 700 leading semiconductor and microelectronics

SEMICON SEA 2025 Read More »

DNN Technology headquartered in Taiwan, is a leading provider of semiconductor equipment and turnkey solutions.

Services

Quick Links

Contact

+886 3-5595858

sales@dnn-tech.com

No. 55, Jinggong Rd., Xinfeng Township, Hsinchu County 304034, Taiwan

Copyright © 2025 All Right Reserved DNN Technology Co., Ltd.

Private Policy

Scroll to Top