Intelligent Process Optimization

DNN EdgeAI+ Process Optimization Solution

Edge AI computing solution purpose-built for the manufacturing industry

TRUSTED BY

Edge AI Product Architecture

01 Software
Qwen 3.5 70B running fully on-premise. Process Q&A, anomaly diagnosis, and maintenance knowledge base — all inference on-device, data never leaves the factory.
02 Hardware
AMD Ryzen AI Max processors with Radeon RDNA 3.5 graphics and a dedicated NPU delivering up to 126 TOPS. Native Windows 11 support with full x86 software and peripheral compatibility for fast production-line integration.
03 Application
Laser TGV, ALD, etch, and more. AI monitors sensor data, detects drift, and feeds real-time corrections back to the equipment — fully autonomous.

DNN EdgeAI Key Advantages

DNN EdgeAI+ integrates process parameters with AOI inspection data, using AI algorithms and historical records for Run-to-Run monitoring — autonomously detecting process drift, predicting optimal parameters in real time, and issuing corrective commands directly to equipment to ensure yield and quality on every batch.

INFERENCE ENGINE
Real-Time Inference Engine
ON-PREMISE SERVER
On-Premise Training for Data Security
CUSTOM HARDWARE
Custom Hardware Configured Per Client
AUTONOMOUS PROCESS
Autonomous Process Optimization
Service Scope

DNN EdgeAI+ Service Scope

Hardware Platform

Choose the Right Hardware for Your Production Line

DNN EdgeAI+ Edge Computing Device
Entry
DNN EdgeAI+ Lite
Ryzen 5 8645HS Series
AMD

└─ CPU Ryzen 5 8645HS (6C/12T, Zen 4)
└─ GPU Radeon 760M (8 CU, RDNA 3)
└─ NPU 16 TOPS (38 TOPS Total)
└─ Memory 16 GB DDR5-5600 SO-DIMM (8 GB option)
└─ Storage 512 GB M.2 2280 NVMe
└─ Power 120W DC adapter

Base
DNN EdgeAI+ Base
Ryzen AI 9 HX 370 Series
AMD

└─ CPU Ryzen AI 9 HX 370 (12C/24T, Zen 5/5c)
└─ GPU Radeon 890M (16 CU, RDNA 3.5)
└─ NPU 50 TOPS (80 TOPS Total)
└─ Memory 32 GB DDR5-5600 SO-DIMM (up to 64 GB)
└─ Storage 1 TB M.2 2280 NVMe
└─ Power 180W DC adapter

Standard
DNN EdgeAI+ Pro
Ryzen AI Max+ 395 · Strix Halo
AMD

└─ CPU Ryzen AI Max+ 395 (16C/32T)
└─ GPU Radeon 8060S (40 CU)
└─ NPU 50 TOPS (126 TOPS Total)
└─ Memory 64 GB LPDDR5x-8000 (soldered)
└─ Storage 1 TB M.2 NVMe × 2
└─ Power 240W DC adapter

Flagship
DNN EdgeAI+ Max
Ryzen AI Max+ PRO 395 · 128GB Strix Halo
AMD

└─ CPU Ryzen AI Max+ PRO 395 (16C/32T, Zen 5)
└─ GPU Radeon 8060S (40 CU, RDNA 3.5)
└─ NPU 50 TOPS (126 TOPS Total)
└─ Memory 128 GB LPDDR5x-8000, soldered (112GB VRAM available)
└─ Storage 2 TB M.2 NVMe + M.2 expansion slot
└─ Power 240W DC adapter (TDP 120W)

Spec DNN EdgeAI+ Lite
Entry · Ryzen 5 8645HS
DNN EdgeAI+ Base
Base · Ryzen AI 9 HX 370
DNN EdgeAI+ Pro
Standard · Ryzen AI Max+ 395
DNN EdgeAI+ Max
Flagship · Ryzen AI Max+ PRO 395
CPURyzen 5 8645HS (6C/12T, Zen 4)Ryzen AI 9 HX 370 (12C/24T, Zen 5/5c)Ryzen AI Max+ 395 (16C/32T)Ryzen AI Max+ PRO 395 (16C/32T, Zen 5)
GPURadeon 760M (8 CU, RDNA 3)Radeon 890M (16 CU, RDNA 3.5)Radeon 8060S (40 CU)Radeon 8060S (40 CU, RDNA 3.5)
NPU16 TOPS (38 TOPS Total)NPU50 TOPS (80 TOPS Total)NPU50 TOPS (126 TOPS Total)NPU50 TOPS (126 TOPS Total)NPU
Memory16 GB DDR5-5600 SO-DIMM (8 GB option)32 GB DDR5-5600 SO-DIMM (up to 64 GB)64 GB LPDDR5x-8000 (soldered)128 GB LPDDR5x-8000, soldered (112GB VRAM available)
Storage512 GB M.2 2280 NVMe1 TB M.2 2280 NVMe1 TB M.2 NVMe × 22 TB M.2 NVMe + M.2 expansion slot
Power120W DC adapter180W DC adapter240W DC adapter240W DC adapter (TDP 120W)

AI Models Trained for Your Production Line

DNN EdgeAI+ trains on your process data, equipment logs, SOPs, and historical anomaly cases to build an Edge AI model exclusive to your production line.
Engineers get instant root-cause analysis, optimal parameter prediction, and traceable corrective guidance.

PART 01 How Do We Train the Model?
Factory Data Sources
Process Data SPC · FDC
Metrology · CD
Thickness · Defect
Equipment Data Equipment Log
Alarm Log
Sensor · RF Power
Engineering Docs SOP · Recipe Spec
Maintenance Manual
Troubleshooting
Historical Cases Defect Report
Abnormal Case
Engineer Notes
Production Feedback Engineer Actions
Improvement Results
Recipe Updates
Local Server / Production Line Model
Powered By Superdigital · In-house brand, not outsourced
01Ingestion
02Cleaning
03Knowledge Base
04RAG Vectors
05Fine-Tuning
06Versioning
07Validation
08Deploy
Deploy Custom Process AI Agent
DNN EdgeAI+
Production Model

Learns from process data models with Fine-Tuning
Deployed at the equipment level — from single unit to multi-unit to full line

Training Complete · Ready to Deploy
PART 02 Ask a Question, Get Instant AI Diagnosis
DNN EdgeAI+ · Process Diagnosis Engine
01 Input
→
02 Semantic Parse
→
03 Knowledge Retrieval
→
04 Context Fusion
→
05 AI Inference
→
06 Output
D
D
DNN EdgeAI+ Diagnosis Complete
Root Cause Analysis
Recommended Actions
✦
Technical Explanations
RAG

Retrieval-Augmented Generation

At inference time, relevant documents are retrieved in real time from an external knowledge base and injected as factual context — ensuring every diagnosis has a traceable, verifiable document source.

Fine-Tuning

Domain Fine-Tuning

Pre-trained models undergo secondary training on semiconductor-specific data using LoRA / QLoRA low-rank adapter techniques — enabling deep understanding of SPC, FDC, Metrology terminology and causal logic.

Dual-Track Fusion

Domain Depth + Real-Time Evidence

Fine-Tuning provides domain depth; RAG provides real-time document augmentation. Together they achieve accuracy neither technology can reach alone — producing evidence-backed process diagnosis answers.

Embedding

Vector Index Infrastructure

Text is mapped to high-dimensional vector space via an embedding model — semantically similar content sits closer together. Chunking strategy directly determines the knowledge base's retrieval precision and recall rate.

Let Processes Find Optimal Parameters Autonomously on DNN EdgeAI+

Integrating sensor data collection, multivariate neural network inference, real-time parameter feedback, and a visual monitoring interface

④ AI Chat Widget
AnythingLLM | OI
Apps
REST API
RAG
Ollama
vLLM
Llama.cpp
③ AI Model
LlamaGemmaDeepSeekgpt-ossQwen
① Container Station
QuTS hero
② GPU
Acceleration
Case Study · Semiconductor Process

Closed-Loop Process Control — Live Demo

Three process scenarios showcasing how EdgeAI+ learns in real time and automatically converges process parameters

Edge AI — ALD Closed-Loop Process Control

SEMICONDUCTOR PROCESS CONTROL CYCLE 1 / 2
ALD Process
DEPOSITION
Film Measurement
MEASUREMENT
EdgeAI+ Analysis
WAFER MAP AI
Decision
DECISION
Adjust Params
ADJUST PARAMS
✓ Target Met
TARGET MET
Deposition
Metrology
AI Inference
Spec Judge
NG→Closed Loop
OK→Confirm
Wafer Map — Film Thickness Distribution
AVG THICK
—
NON-UNIF
—
MAX DEV
—
YIELD EST
—
Film Thickness SPC — Thickness (nm)
TARGET
50.0
UCL/LCL
52/48
LATEST
—
Deviation SPC — |Δ| (nm)
SPEC
±2.0nm
Cpk
—
STATUS
—
READY
System Ready — Starting ALD Closed-Loop Process Control Simulation
TEMP200°C
CYCLES150
PRES0.50T
FLOW100sccm
Case 02
Laser Via Hole · Advanced Process Control
Semiconductor Packaging
CYCLE 01 / 06
⚡ Laser Parameters
Energy42.0 µJ
Pulse380 fs
Frequency200 kHz
Focus-2.0 µm
🎯 Target
Depth80.0 µm
Diameter30.0 µm
Tolerance±2.0 µm
LASER
AOI
EdgeAI+
✓ LASER VIA CONVERGED
DNN EdgeAI+
STANDBY · Laser Via APC
📐 AOI Measurements
DEPTH
— µm
TARGET: 80.0 ±2.0 µm
Δ —
DIAMETER
— µm
TARGET: 30.0 ±2.0 µm
Δ —
Convergence
CONSECUTIVE OK
0
/ 3 required
LASER PROCESS
AOI METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1
Case 03
Thin Film Deposition · CVD / PECVD Process Control
Semiconductor Thin Film
CYCLE 01 / 06
⚡ Process Parameters
Time225.0 s
RF Power380 W
SiH₄68.0 sccm
N₂O190 sccm
🎯 Target
Thickness500 nm
Tolerance±5 nm
FilmSiO₂
CVD CHAMBER
RF SiH₄ N₂O EXH
METROLOGY
Thk
EdgeAI+
DNN
✓ FILM THICKNESS CONVERGED
DNN EdgeAI+
STANDBY · Multi-Variable CVD
📐 Metrology
FILM THICKNESS
— nm
TARGET: 500 ±5 nm
Δ —
Thickness Trend
500nm
CONSECUTIVE OK
0
/ 3 required
CVD PROCESS
METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1

Edge AI FAQ

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