Intelligent Process Optimization

DNN EdgeAI+ Process Optimization Solution

Edge AI computing solution purpose-built for the semiconductor industry

TRUSTED BY

Edge AI Product Architecture

01 Software
Qwen 3.5 70B running fully on-premise. Process Q&A, anomaly diagnosis, and maintenance knowledge base — all inference on-device, data never leaves the factory.
02 Hardware
NVIDIA Jetson modules with Ampere GPU and Tensor Core acceleration — 20 to 275 TOPS edge compute. Compact, easy to integrate, operating from -20°C to 70°C.
03 Application
Laser TGV, ALD, etch, and more. AI monitors sensor data, detects drift, and feeds real-time corrections back to the equipment — fully autonomous.

DNN EdgeAI Key Advantages

DNN EdgeAI+ integrates process parameters with AOI inspection data, using AI algorithms and historical records for Run-to-Run monitoring — autonomously detecting process drift, predicting optimal parameters in real time, and issuing corrective commands directly to equipment to ensure yield and quality on every batch.

INFERENCE ENGINE
Real-Time Inference Engine
ON-PREMISE SERVER
On-Premise Training for Data Security
CUSTOM HARDWARE
Custom Hardware Configured Per Client
AUTONOMOUS PROCESS
Autonomous Process Optimization
Service Scope

DNN EdgeAI+ Service Scope

Hardware Platform

Choose the Right Hardware for Your Production Line

DNN EdgeAI+ Edge Computing Device
Entry
DNN EdgeAI+
(20 / 40 TOPS)
NVIDIA Jetson

20 / 40 TOPS  AI Inference
└─ Platform Jetson Orin Nano
└─ Compute 20 / 40 TOPS
└─ GPU 512-core Ampere · 16 TC
└─ CPU 6-core A78AE 64-bit
└─ Memory 4 / 8 GB LPDDR5
└─ I/O USB 3.0 ×2 · HDMI · NVMe
└─ Temp -20 ~ 70°C

Standard
DNN EdgeAI+
(70 / 100 TOPS)
NVIDIA Jetson

70 / 100 TOPS  AI Inference
└─ Platform Jetson Orin NX
└─ Compute 70 / 100 TOPS
└─ GPU 1024-core Ampere · 32 TC
└─ CPU 6 / 8-core A78AE 64-bit
└─ Memory 8 / 16 GB LPDDR5
└─ I/O USB 3.0 ×2 · HDMI · NVMe
└─ Temp -20 ~ 70°C

Flagship
DNN EdgeAI+
(200 / 275 TOPS)
NVIDIA Jetson

200 / 275 TOPS  AI Inference
└─ Platform Jetson AGX Orin
└─ Compute 200 / 275 TOPS
└─ GPU 1792-core Ampere · 56 TC
└─ CPU 8 / 12-core A78AE 64-bit
└─ Memory 32 / 64 GB LPDDR5
└─ I/O USB 3.2 Gen2 · HDMI · NVMe
└─ Temp -20 ~ 60°C

Spec DNN EdgeAI+ (20/40 TOPS)
Entry · Orin Nano
DNN EdgeAI+ (70/100 TOPS)
Standard · Orin NX
DNN EdgeAI+ (200/275 TOPS)
Flagship · AGX Orin
AI Compute20 / 40 TOPS NPU70 / 100 TOPS NPU200 / 275 TOPS NPU
GPU512-core Ampere (16 TC)1024-core Ampere (32 TC)1792-core Ampere (56 TC)
CPU6-core A78AE 64-bit6 / 8-core A78AE 64-bit8 / 12-core A78AE 64-bit
Memory4GB / 8GB LPDDR58GB / 16GB LPDDR532GB / 64GB LPDDR5
InterfacesUSB 3.0 × 2, HDMI, M.2USB 3.0 × 2, HDMI, M.2USB 3.2 Gen2, HDMI, M.2
Operating Temp-20°C ~ 70°C-20°C ~ 70°C-20°C ~ 60°C

AI Models Purpose-Built for Semiconductor Processes

DNN EdgeAI+ trains on your process data, equipment logs, SOPs, and historical anomaly cases to build a model exclusive to your fab.
Engineers get instant root-cause analysis, optimal parameter prediction, and traceable corrective guidance.

PART 01 How Do We Train the Model?
Factory Data Sources
Process Data SPC · FDC
Metrology · CD
Thickness · Defect
Equipment Data Equipment Log
Alarm Log
Sensor · RF Power
Engineering Docs SOP · Recipe Spec
Maintenance Manual
Troubleshooting
Historical Cases Defect Report
Abnormal Case
Engineer Notes
Production Feedback Engineer Actions
Improvement Results
Recipe Updates
Local Server / Semiconductor Process Model
Powered By Superdigital · In-house brand, not outsourced
01Ingestion
02Cleaning
03Knowledge Base
04RAG Vectors
05Fine-Tuning
06Versioning
07Validation
08Deploy
Deploy Custom Process AI Agent
DNN EdgeAI+
Production Model

Learns from process data models with Fine-Tuning
Deployed at the equipment level — from single unit to multi-unit to full line

Training Complete · Ready to Deploy
PART 02 Ask a Question, Get Instant AI Diagnosis
DNN EdgeAI+ · Process Diagnosis Engine
01 Input
02 Semantic Parse
03 Knowledge Retrieval
04 Context Fusion
05 AI Inference
06 Output
D
D
DNN EdgeAI+ Diagnosis Complete
Root Cause Analysis
Recommended Actions
Technical Explanations
RAG

Retrieval-Augmented Generation

At inference time, relevant documents are retrieved in real time from an external knowledge base and injected as factual context — ensuring every diagnosis has a traceable, verifiable document source.

Fine-Tuning

Domain Fine-Tuning

Pre-trained models undergo secondary training on semiconductor-specific data using LoRA / QLoRA low-rank adapter techniques — enabling deep understanding of SPC, FDC, Metrology terminology and causal logic.

Dual-Track Fusion

Domain Depth + Real-Time Evidence

Fine-Tuning provides domain depth; RAG provides real-time document augmentation. Together they achieve accuracy neither technology can reach alone — producing evidence-backed process diagnosis answers.

Embedding

Vector Index Infrastructure

Text is mapped to high-dimensional vector space via an embedding model — semantically similar content sits closer together. Chunking strategy directly determines the knowledge base's retrieval precision and recall rate.

Let Processes Find Optimal Parameters Autonomously on DNN EdgeAI+

Integrating sensor data collection, multivariate neural network inference, real-time parameter feedback, and a visual monitoring interface

AI Chat Widget
AnythingLLM | OI
Apps
REST API
RAG
Ollama
vLLM
Llama.cpp
AI Model
LlamaGemmaDeepSeekgpt-ossQwen
Container Station
QuTS hero
GPU
Acceleration
Case Study · Semiconductor Process

Closed-Loop Process Control — Live Demo

Three process scenarios showcasing how EdgeAI+ learns in real time and automatically converges process parameters

Edge AI — ALD Closed-Loop Process Control

SEMICONDUCTOR PROCESS CONTROL CYCLE 1 / 2
ALD Process
DEPOSITION
Film Measurement
MEASUREMENT
EdgeAI+ Analysis
WAFER MAP AI
Decision
DECISION
Adjust Params
ADJUST PARAMS
✓ Target Met
TARGET MET
Deposition
Metrology
AI Inference
Spec Judge
NG→Closed Loop
OK→Confirm
Wafer Map — Film Thickness Distribution
AVG THICK
NON-UNIF
MAX DEV
YIELD EST
Film Thickness SPC — Thickness (nm)
TARGET
50.0
UCL/LCL
52/48
LATEST
Deviation SPC — |Δ| (nm)
SPEC
±2.0nm
Cpk
STATUS
READY
System Ready — Starting ALD Closed-Loop Process Control Simulation
TEMP200°C
CYCLES150
PRES0.50T
FLOW100sccm
Case 02
Laser Via Hole · Advanced Process Control
Semiconductor Packaging
CYCLE 01 / 06
⚡ Laser Parameters
Energy42.0 µJ
Pulse380 fs
Frequency200 kHz
Focus-2.0 µm
🎯 Target
Depth80.0 µm
Diameter30.0 µm
Tolerance±2.0 µm
LASER
AOI
EdgeAI+
✓ LASER VIA CONVERGED
DNN EdgeAI+
STANDBY · Laser Via APC
📐 AOI Measurements
DEPTH
— µm
TARGET: 80.0 ±2.0 µm
Δ —
DIAMETER
— µm
TARGET: 30.0 ±2.0 µm
Δ —
Convergence
CONSECUTIVE OK
0
/ 3 required
LASER PROCESS
AOI METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1
Case 03
Thin Film Deposition · CVD / PECVD Process Control
Semiconductor Thin Film
CYCLE 01 / 06
⚡ Process Parameters
Time225.0 s
RF Power380 W
SiH₄68.0 sccm
N₂O190 sccm
🎯 Target
Thickness500 nm
Tolerance±5 nm
FilmSiO₂
CVD CHAMBER
RF SiH₄ N₂O EXH
METROLOGY
Thk
EdgeAI+
DNN
✓ FILM THICKNESS CONVERGED
DNN EdgeAI+
STANDBY · Multi-Variable CVD
📐 Metrology
FILM THICKNESS
— nm
TARGET: 500 ±5 nm
Δ —
Thickness Trend
500nm
CONSECUTIVE OK
0
/ 3 required
CVD PROCESS
METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1

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