Intelligent Process Optimization

DNN EdgeAI+ Process Optimization Solution

Edge AI computing solution purpose-built for the semiconductor industry

TRUSTED BY

Edge AI Product Architecture

01 Software
Qwen 3.5 70B running fully on-premise. Process Q&A, anomaly diagnosis, and maintenance knowledge base — all inference on-device, data never leaves the factory.
02 Hardware
AMD Ryzen AI Max processors with Radeon RDNA 3.5 graphics and a dedicated NPU delivering up to 126 TOPS. Native Windows 11 support with full x86 software and peripheral compatibility for fast production-line integration.
03 Application
Laser TGV, ALD, etch, and more. AI monitors sensor data, detects drift, and feeds real-time corrections back to the equipment — fully autonomous.

DNN EdgeAI Key Advantages

DNN EdgeAI+ integrates process parameters with AOI inspection data, using AI algorithms and historical records for Run-to-Run monitoring — autonomously detecting process drift, predicting optimal parameters in real time, and issuing corrective commands directly to equipment to ensure yield and quality on every batch.

INFERENCE ENGINE
Real-Time Inference Engine
ON-PREMISE SERVER
On-Premise Training for Data Security
CUSTOM HARDWARE
Custom Hardware Configured Per Client
AUTONOMOUS PROCESS
Autonomous Process Optimization
Service Scope

DNN EdgeAI+ Service Scope

Hardware Platform

Choose the Right Hardware for Your Production Line

DNN EdgeAI+ Edge Computing Device
Entry
DNN EdgeAI+
HX370 / 8845HS Series
AMD Win11

└─ Platform Ryzen AI 9 HX 370 / R7 8845HS
└─ GPU Radeon 890M · 16 CU / 780M · 12 CU
└─ CPU 12-core Zen 5/5c · 24T · 5.1 GHz
└─ NPU 50 TOPS · 80 TOPS Total
└─ Memory 32 / 64 GB DDR5-5600
└─ I/O USB4 · HDMI · DP · Dual 2.5G LAN
└─ WiFi Wi-Fi 7 · BT 5.4

Standard
DNN EdgeAI+ Pro
Ryzen AI Max · Strix Halo
AMD Win11

└─ Platform AMD Ryzen AI Max 395
└─ GPU Radeon 8060S · 40 CU RDNA 3.5
└─ CPU 16-core Zen 5 · 32T · 5.1 GHz
└─ NPU 50 TOPS · 126 TOPS Total
└─ Memory 64 GB LPDDR5x-8000
└─ I/O USB4 · HDMI 2.1 · DP 1.4 · NVMe
└─ Power 120W · Dual M.2 PCIe 4.0

Flagship
DNN EdgeAI+ Max
Ryzen AI Max+ PRO · 128GB Strix Halo
AMD Win11

└─ Platform AMD Ryzen AI Max+ PRO 395
└─ GPU Radeon 8060S · 40 CU RDNA 3.5
└─ CPU 16-core Zen 5 · 32T · 5.1 GHz
└─ NPU 50 TOPS · 126 TOPS Total
└─ Memory 128 GB LPDDR5x-8000 (112GB VRAM)
└─ Storage 2TB PCIe 4.0 SSD + M.2 Expansion
└─ I/O USB4 ×2 · HDMI 2.1 · DP 1.4 · OCuLink

Spec DNN EdgeAI+
Entry · HX370 / 8845HS
DNN EdgeAI+ Pro
Standard · Ryzen AI Max
DNN EdgeAI+ Max
Flagship · Ryzen AI Max+ PRO
PlatformRyzen AI 9 HX 370 / R7 8845HSAMD Ryzen AI Max 395AMD Ryzen AI Max+ PRO 395
GPURadeon 890M · 16 CU / 780M · 12 CURadeon 8060S · 40 CU RDNA 3.5Radeon 8060S · 40 CU RDNA 3.5
CPU12-core Zen 5/5c · 24T · 5.1 GHz16-core Zen 5 · 32T · 5.1 GHz16-core Zen 5 · 32T · 5.1 GHz
NPU50 TOPS · 80 TOPS Total NPU50 TOPS · 126 TOPS Total NPU50 TOPS · 126 TOPS Total NPU
Memory32 / 64 GB DDR5-560064 GB LPDDR5x-8000128 GB LPDDR5x-8000 (112GB VRAM)
Storage2TB PCIe 4.0 SSD + M.2 Expansion
InterfacesUSB4 · HDMI · DP · Dual 2.5G LANUSB4 · HDMI 2.1 · DP 1.4 · NVMeUSB4 ×2 · HDMI 2.1 · DP 1.4 · OCuLink
Power120W · Dual M.2 PCIe 4.0
WiFiWi-Fi 7 · BT 5.4

AI Models Purpose-Built for Semiconductor Processes

DNN EdgeAI+ trains on your process data, equipment logs, SOPs, and historical anomaly cases to build a model exclusive to your fab.
Engineers get instant root-cause analysis, optimal parameter prediction, and traceable corrective guidance.

PART 01 How Do We Train the Model?
Factory Data Sources
Process Data SPC · FDC
Metrology · CD
Thickness · Defect
Equipment Data Equipment Log
Alarm Log
Sensor · RF Power
Engineering Docs SOP · Recipe Spec
Maintenance Manual
Troubleshooting
Historical Cases Defect Report
Abnormal Case
Engineer Notes
Production Feedback Engineer Actions
Improvement Results
Recipe Updates
Local Server / Semiconductor Process Model
Powered By Superdigital · In-house brand, not outsourced
01Ingestion
02Cleaning
03Knowledge Base
04RAG Vectors
05Fine-Tuning
06Versioning
07Validation
08Deploy
Deploy Custom Process AI Agent
DNN EdgeAI+
Production Model

Learns from process data models with Fine-Tuning
Deployed at the equipment level — from single unit to multi-unit to full line

Training Complete · Ready to Deploy
PART 02 Ask a Question, Get Instant AI Diagnosis
DNN EdgeAI+ · Process Diagnosis Engine
01 Input
02 Semantic Parse
03 Knowledge Retrieval
04 Context Fusion
05 AI Inference
06 Output
D
D
DNN EdgeAI+ Diagnosis Complete
Root Cause Analysis
Recommended Actions
Technical Explanations
RAG

Retrieval-Augmented Generation

At inference time, relevant documents are retrieved in real time from an external knowledge base and injected as factual context — ensuring every diagnosis has a traceable, verifiable document source.

Fine-Tuning

Domain Fine-Tuning

Pre-trained models undergo secondary training on semiconductor-specific data using LoRA / QLoRA low-rank adapter techniques — enabling deep understanding of SPC, FDC, Metrology terminology and causal logic.

Dual-Track Fusion

Domain Depth + Real-Time Evidence

Fine-Tuning provides domain depth; RAG provides real-time document augmentation. Together they achieve accuracy neither technology can reach alone — producing evidence-backed process diagnosis answers.

Embedding

Vector Index Infrastructure

Text is mapped to high-dimensional vector space via an embedding model — semantically similar content sits closer together. Chunking strategy directly determines the knowledge base's retrieval precision and recall rate.

Let Processes Find Optimal Parameters Autonomously on DNN EdgeAI+

Integrating sensor data collection, multivariate neural network inference, real-time parameter feedback, and a visual monitoring interface

AI Chat Widget
AnythingLLM | OI
Apps
REST API
RAG
Ollama
vLLM
Llama.cpp
AI Model
LlamaGemmaDeepSeekgpt-ossQwen
Container Station
QuTS hero
GPU
Acceleration
Case Study · Semiconductor Process

Closed-Loop Process Control — Live Demo

Three process scenarios showcasing how EdgeAI+ learns in real time and automatically converges process parameters

Edge AI — ALD Closed-Loop Process Control

SEMICONDUCTOR PROCESS CONTROL CYCLE 1 / 2
ALD Process
DEPOSITION
Film Measurement
MEASUREMENT
EdgeAI+ Analysis
WAFER MAP AI
Decision
DECISION
Adjust Params
ADJUST PARAMS
✓ Target Met
TARGET MET
Deposition
Metrology
AI Inference
Spec Judge
NG→Closed Loop
OK→Confirm
Wafer Map — Film Thickness Distribution
AVG THICK
NON-UNIF
MAX DEV
YIELD EST
Film Thickness SPC — Thickness (nm)
TARGET
50.0
UCL/LCL
52/48
LATEST
Deviation SPC — |Δ| (nm)
SPEC
±2.0nm
Cpk
STATUS
READY
System Ready — Starting ALD Closed-Loop Process Control Simulation
TEMP200°C
CYCLES150
PRES0.50T
FLOW100sccm
Case 02
Laser Via Hole · Advanced Process Control
Semiconductor Packaging
CYCLE 01 / 06
⚡ Laser Parameters
Energy42.0 µJ
Pulse380 fs
Frequency200 kHz
Focus-2.0 µm
🎯 Target
Depth80.0 µm
Diameter30.0 µm
Tolerance±2.0 µm
LASER
AOI
EdgeAI+
✓ LASER VIA CONVERGED
DNN EdgeAI+
STANDBY · Laser Via APC
📐 AOI Measurements
DEPTH
— µm
TARGET: 80.0 ±2.0 µm
Δ —
DIAMETER
— µm
TARGET: 30.0 ±2.0 µm
Δ —
Convergence
CONSECUTIVE OK
0
/ 3 required
LASER PROCESS
AOI METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1
Case 03
Thin Film Deposition · CVD / PECVD Process Control
Semiconductor Thin Film
CYCLE 01 / 06
⚡ Process Parameters
Time225.0 s
RF Power380 W
SiH₄68.0 sccm
N₂O190 sccm
🎯 Target
Thickness500 nm
Tolerance±5 nm
FilmSiO₂
CVD CHAMBER
RF SiH₄ N₂O EXH
METROLOGY
Thk
EdgeAI+
DNN
✓ FILM THICKNESS CONVERGED
DNN EdgeAI+
STANDBY · Multi-Variable CVD
📐 Metrology
FILM THICKNESS
— nm
TARGET: 500 ±5 nm
Δ —
Thickness Trend
500nm
CONSECUTIVE OK
0
/ 3 required
CVD PROCESS
METROLOGY
AI INFERENCE
PARAM UPDATE
ITERATION 1

Edge AI FAQ

Contact Us

Send an Inquiry
We will get back to you within one business day
Social Media
Scroll to Top