Semiconductor Equipment Catalog

Multi-layer parameter support with high-precision alignment for multi-material laser cutting and etching

IC chip ink marking with hydrogen flame curing, 0.1 mm precision, auto load/unload of 25 trays at once

IPG fiber laser with CCD vision alignment for precise barcode and 2D code marking on PCB substrates and wafers

High-precision aligned dispensing, compatible with multiple adhesives and nozzles, for chip packaging underfill processes

Waterless, chemical-free dry cleaning that effectively removes micron-level particles and grease; German nozzles cut CO2 consumption by 30–50%

Measurement range 50 nm–20 µm, accuracy <2 nm, non-contact in-process thin-film thickness inspection

Automated laser engraving on JEDEC trays for batch tracking and management