SEMI Southeast Asia 2025｜TECH STAGE Presentation
Our Project Manager Chris Wang delivered an insightful talk at SEMI Southeast Asia 2025, “Advanced Packaging Design, Manufacturing, and Testing Introduction”
🔍 Key Takeaways from the Talk
1️⃣Chiplets: Definition & Benefits
• Separately manufactured chips integrated via advanced packaging
• Each chip uses the most suitable process node (e.g., advanced for logic, mature for analog)
• Addresses SoC design and cost limitations
2️⃣ Advanced Packaging & Interconnects
• 2.5D packaging: side-by-side chip integration on an interposer
• 3D packaging: vertically stacked chips with shorter signal paths
• Benefits include higher I/O bandwidth and lower power
3️⃣ Challenges & Future Outlook
• Requires close collaboration across domains (architecture, RTL, packaging, etc.)
• Increased physical complexity (thermal, stress, aging)
• Security concerns with multi-vendor chiplet sourcing
• Testing challenges: costly and difficult to isolate faults
• Industry still evolving in standardization and ecosystem building
• Despite challenges, chiplets are poised to be a key trend in semiconductor development
About DNN Technology
Headquartered in Taiwan, DNN Technology is a global leader in semiconductor equipment and comprehensive solutions, specializing in used semiconductor equipment trading, laboratory and cleanroom systems construction, and technical consultancy services. With over two decades of industry experience and a team comprising more than thirty experienced technical experts, DNN Technology has successfully executed projects across over fifty countries, committed to providing customized, innovative, and efficient solutions
