DNN Technology

DNN TECHNOLOGY

A computer chip using 2.5D Advanced Packaging technology with chiplets, interposer, TSV, RDL and PCB.

Advanced Packaging Guide (Pt. 1): Why 2.5D & Chiplets Are the Mainstream Choice After Moore’s Law?

Advanced Packaging Guide / By

In the rapidly evolving semiconductor landscape, the traditional path of Moore’s Law is giving way to a revolutionary approach: advanced packaging. As the demand for computational power surges, innovative solutions like 2.5D and chiplet architectures are reshaping how we design and build complex electronic systems. This first article in our series delves into the critical shift from monolithic Systems-on-Chip (SoCs) to modular Systems-in-Package (SiPs), highlighting the transformative potential of advanced packaging. Discover how this paradigm shift is not just a technical evolution but a strategic necessity for the future of electronics.

Advanced Packaging Guide (Pt. 1): Why 2.5D & Chiplets Are the Mainstream Choice After Moore’s Law? Read More »

DNN-TECH 3rd Anniversary

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners​

Press Release / By

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners  Three years ago, DNN-TECHNOLOGY started as a small business with a big vision. Today, we’re celebrating our anniversary—and we couldn’t be prouder of the journey so far! This past year has been filled with growth and new achievements—we expanded into 5 more cities,

DNN-TECHNOLOGY’s 3rd Anniversary: A Journey of Growth and a Thank You to Our Partners​ Read More »

Semiexpo 2024

SEMI Expo Vietnam 2024

Press Release / By

SEMINAR ON OVERVIEW OF SEMICONDUCTOR MANUFACTURING [Vietnam, November 7, 2024] At the BK Smart Tech Office – Hanoi University of Science and Technology, part of the National Innovation Center (NIC) in Hoa Lac High-Tech Park, Hanoi, the seminar “Overview of Semiconductor Manufacturing” was successfully held.  The event attracted a large gathering of industry experts, representatives from

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Tech Stage Presentation

Tech Stage Presentation

Tech Info / By

SEMI Southeast Asia 2025｜TECH STAGE Presentation Our Project Manager Chris Wang delivered an insightful talk at SEMI Southeast Asia 2025, “Advanced Packaging Design, Manufacturing, and Testing Introduction” 🔍 Key Takeaways from the Talk 1️⃣Chiplets: Definition & Benefits • Separately manufactured chips integrated via advanced packaging • Each chip uses the most suitable process node (e.g.,

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DNN's member posing for a photo.

SEMICON SEA 2025

Press Release / By

DNN Technology Demonstrates Outstanding Technical Expertise at SEMICON SEA 2025 [Singapore, May 23, 2025] DNN Technology showcased its exceptional industry influence and technological capabilities at SEMICON SEA 2025, held from May 20 to 22 at the Marina Bay Sands Expo Center in Singapore. The SEMICON SEA 2025 event attracted over 700 leading semiconductor and microelectronics

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